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    24 days ago
    Fraunhofer Institut header
    Fraunhofer Institut logo
    Internship
    #forschung#wissenschaft#innovation

    Student Assistant in High-Frequency Design and Engineering (m/f/x)

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    Intro

    The Fraunhofer Institute for Reliability and Microintegration (IZM) is seeking a student assistant to support their team in the design and development of high-frequency radar sensor modules, 5G and 6G antenna-in-package front-end modules, and RF packaging structures. The role involves literature review, electromagnetic modeling, simulation, and measurement of electronic packaging structures. The position offers the opportunity to work on cutting-edge research projects and continue activities as part of a Bachelor's/Master's thesis.

    Tasks

    • Literature review on state of the art in high-frequency design of electronic packaging structures
    • Electromagnetic modeling, simulation, and layout of electronic packaging structures
    • High-frequency measurement of packaging structures and documentation of results

    Requirements

    • Studying electrical engineering, physics, or a comparable subject
    • Interest in high frequency/microwave engineering
    • Willingness to learn, flexibility, and a solution-oriented way of working
    • Independent and structured working method
    • Ability to work in a team and strong communication skills
    • Good knowledge of German and/or English language

    Benefits

    • Introduction to electromagnetic modeling, simulation, layout, and measurement of electronic packaging structures
    • Continuation of activities as part of a Bachelor's/Master's thesis
    • Flexible design options to suit the study plan
    • Open and collegial working environment
    • State-of-the-art laboratory equipment and software tools for high-frequency design, test, and characterization up to 500 GHz
    • Opportunity to participate in cutting-edge research and development projects with national and international partners
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    24 days ago

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